Nickel block is a dense solid material made of high-purity metallic nickel. It is an indispensable key basic raw material in high-end fields such as semiconductor manufacturing.
1. Ultra-High Purity: Purity is strictly controlled between 99.995% (5N) and 99.999% (5N5). This level of purity is critical for semiconductor applications, keeping harmful impurities (such as sulfur, phosphorus, carbon, and oxygen) to extremely low levels (ppm or even ppb), preventing contamination of sensitive devices and ensuring chip performance and yield.
2. Flexible Size and Weight Customization: We offer fully customized services, providing nickel ingots of the maximum size and weight required to meet specific customer process and equipment requirements. This ensures seamless integration of the material into various production processes.
3. Professional Protective Packaging: We utilize a double-layer protective packaging system. First, the nickel ingots are sealed in plastic to create a physical barrier, effectively preventing surface oxidation, moisture, and physical scratches during transportation and storage. The outer layer is a sturdy wooden box or sealed plastic drum, providing strong mechanical support and cushioning, ensuring the safe and intact arrival of the product in the harsh logistics environment.
4. Core Applications: Semiconductor Manufacturing: Nickel ingots play a central role in the semiconductor industry chain, primarily used for:
--High-purity sputtering target raw materials: As a base raw material, nickel or nickel-based alloy sputtering targets are subsequently processed through precision processing (such as melting, forging, rolling, and bonding) to form targets for physical vapor deposition (PVD) processes. The nickel thin films deposited from these targets are used to construct key internal chip structures such as conductive layers, barrier layers, contact layers, and pads.
--Chemical Vapor Deposition (CVD/ALD) Source Materials: In certain CVD or atomic layer deposition (ALD) processes, high-purity nickel ingots serve as precursors, participating in the reaction to deposit nickel thin films on wafer surfaces.
--Evaporation Source Materials: In vacuum thermal evaporation processes, nickel ingots serve as an evaporation source, heating the target to deposit nickel films directly on substrates.
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