Copper targets are solid sputtering sources made from high-purity copper material. They are primarily used for sputtering coating in physical vapor deposition (PVD) processes, depositing high-performance copper films on substrate surfaces.
1. Ultra-High Purity: The core material purity is strictly controlled at 99.999% (5N) to 99.9999% (6N). This extreme purity minimizes the risk of impurities being introduced into the film, ensuring the deposited films possess excellent electrical and thermal conductivity, ductility, and stability, meeting the stringent requirements of high-end semiconductor, display, and precision optical coatings.
2. Customizable Dimensions & Weight: We offer customizable services. Based on the chamber specifications of the customer's sputtering equipment and specific process requirements, we can custom-manufacture copper targets to the required maximum size and weight, achieving optimal coating efficiency and material utilization.
3. Robust Packaging: Triple protection ensures safe transportation:
Core Protection: The target material is vacuum-packed in two layers to effectively isolate air moisture, prevent oxidation, and prevent surface contamination.
4. Cushioning Protection: The vacuum packaging is filled with high-performance pearlescent foam (EPE) cushioning material to absorb shock and vibration, preventing physical damage.
5. Outer Box Reinforcement: The outermost layer is enclosed in a sturdy wooden box, providing strong structural support and resistance to external impact, ensuring safe global transportation.
6. Primary Application: Designed for sputtering coating processes such as magnetron sputtering and ion beam sputtering. In a high vacuum environment, high-energy particles bombard the target material, sputtering copper atoms from the target surface. These atoms are then deposited on substrates (such as silicon wafers, glass, and polymer films), forming a uniform, dense, and highly adherent functional copper film.
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