High-purity copper ingots are an industrial base material made from electrolytic copper, refined and cast. Their ultra-high purity meets the stringent requirements of the cutting-edge electronics manufacturing industry.
▸Purity Grades
A variety of specifications are available, ranging from 99.99% (4N) to 99.99999% (7N). Key impurity elements (such as oxygen, sulfur, and metallic impurities) are contained at levels ranging from ppm to ppb, ensuring the material's electrical conductivity and chemical stability.
▸Physical Specifications
Maximum Size: ≤600mm in diameter (custom diameter and height combinations available upon request).
Maximum Unit Weight: ≤3000kg (3 metric tons), suitable for large-scale production and heavy equipment.
▸Professional Protective Packaging
Inner Protection: Each ingot is tightly wrapped with high-strength industrial stretch film to protect against scratches, oxidation, and moisture intrusion.
Cushioning Layer: Custom slotted pearl cotton lining fits snugly to the ingot body, effectively absorbing transportation shock. Outer Packaging: Reinforced export wooden crates (ISPM15 heat-treated and certified) that meet international transport standards, offering excellent pressure resistance, moisture resistance, and stacking stability.
▸Core Applications
Semiconductor Manufacturing: Used as a raw material for high-purity sputtering target substrates, bonding wires, copper-plated anodes, and vacuum chamber components. Purity directly impacts chip yield and performance.
Flat Panel Displays (LCD/OLED): Used in thin-film transistor (TFT) array wiring materials, electromagnetic shielding layers, and high-precision etched components, requiring extremely low impurities to prevent display defects.
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